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Data Sheet No.PD 6.039B
IRSF3011
FULLY PROTECTED POWER MOSFET SWITCH
Features
* * * * * * * *
Extremely Rugged for Harsh Operating Environments Over-Temperature Protection Over-Current Protection Active Drain-to-Source Clamp ESD Protection Compatible with Standard Power MOSFET Low Operating Input Current Monolithic Construction
Vds(clamp) Rds(on) Ids(sd) Tj(sd) EAS Applications
50V 200m 5A 155C 200mJ
Description
The IRSF3011 is a three-terminal monolithic Smart Power MOSFET with built-in short circuit, over-temperature, ESD and over-voltage protections. The on-chip protection circuit latches off the power MOSFET in case the drain current exceeds 7A or the junction temperature exceeds 165C and keeps it off until the input is driven low. The drain-to-source voltage is actively clamped at 55V (typical), prior to the avalanche of POWER MOSFET, thus improving its performance during turn-off with inductive loads. The input current requirements are very low (300A) which makes the IRSF3011 compatible with most existing designs based on standard power MOSFETs.
* *
Solenoid Driver DC Motor Driver
Available Packages
IRSF3011 (TO-220AB) IRSF3011L (SOT-223)
IRSF3011 Block Diagram
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IRSF3011
Absolute Maximum Ratings
Absolute Maximum Ratings indicate sustained limits beyond which damage to the device may occur. (Tc = 25C unless otherwise specified.)
Minimum Maximum
Vds, max Vin, max Ids Pd E AS Vesd1 Vesd2 TJop TStg TL Continuous Drain to Source Voltage Continuous Input Voltage Continuous Drain Current Power Dissipation Unclamped Single Pulse Inductive Energy Electrostatic Discharge Voltage (Human Body Model) Electrostatic Discharge Voltage (Machine Model) Operating Junction Temperature Range Storage Temperature Range Lead Temperature (Soldering, 10 seconds) -0.3 -55 -55 50 10
self limited
Units
V
Test Conditions
30 200 4000 1000 self-limited 175 300
W mJ V
Tc 25C 1000pF. 1.5k 200pF, 0
C
Static Electrical Characteristics
(Tc = 25C unless otherwise specified.)
Minimum Typical Maximum Units
V ds,clamp R ds(on) Drain to Source Clamp Voltage Drain to Source On Resistance 50 1.5 10 54 56 155 200 115 10 2.0 0.25 0.35 0.5 0.6 10.8 1.2 62 200 10 100 250 2.5 0.6 0.85 1.0 1.2 1.5 V m
Test Conditions
Ids = 10mA Ids = 6A, tp = 700 S Vin = 5V, Ids = 2A Vin = 4V, Ids = 2A Vin = 10V, Ids = 2A Vds = 12V, Vin = 0V Vds = 50V, Vin = 0V Vds=40V,Vin=0V,Tc =150C Vds = 5V, Ids = 10mA Vin = 5V Vin = 10V Vin = 5V Vin = 10V Iin = 10mA Ids = -9A, Rin = 1k
I dss
Drain to Source Leakage Current
A V mA
V th I i,on I i, off V in, clamp V sd
Input Threshold Voltage Input Supply Current (Normal Operation) Input Supply Current (Protection Mode) Input Clamp Voltage Body-Drain Diode Forward Drop
V
Thermal Characteristics
Minimum Typical Maximum Units
Rjc RjA Rjc RjA
2
Test Conditions
TO-220AB SOT-223
Junction to Case Junction to Ambient Junction to PCB Junction to PCB


4 62 40 60
C/W C/W
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IRSF3011
Switching ElectricalCharacteristics
(VCC = 14V, Resistive Load (R L) = 5, TC= 25C.) Please refer to Figure 15 for switching time definitions.
Minimum Typical Maximum Units
tdon tr tdoff tf Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time 160 90 650 250 250 300 180 170 250 1200 350 350
Test Conditions
Vin = 5V Vin = 10V Vin = 5V Vin = 10V Vin = 5V Vin = 10V Vin = 5V Vin = 10V
nS
Protection Characteristics
(TC= 25 C unless otherwise specified.)
Minimum Typical Maximum Units
Ids(sd) Tj(sd) Vprotect tIresp tIblank Ipeak Vreset treset tTresp Over-Current Shutdown Threshold Over Temperature Shutdown Threshold Min. Input Voltage for Over-temp function Over Current Response Time Over Current Blanking Time Peak Short Circuit Current Protection Reset Voltage Protection Reset Time Over-Temperature Response Time 5 155 7 165 3 4 4 16 1.3 8 12 10 A C V S A V S
Test Conditions
Vin = 5V Vin = 5V, Ids = 2A See Figure 16 for definition See Figure 16 for definition See Figure 16 for definition See Figure 17 for definition See Figure 18 for definition
Temperature Coefficients of Electrical Characteristics
(Please see Figures 3 through 14 for more data on thermal characteristics of other electrical parameters.
Minimum Typical Maximum Units
Vds,clamp Vth Vin,clamp Ids(sd) Drain-to-Source Clamp Voltage T.C. Input Threshold Voltage T.C. Input Clamp Voltage T.C. Over-Current Shutdown Threshold T.C. 18.2 -2.7 7.0 -9.8
Test Conditions
Ids = 10mA mV/C Vds = 5V, Ids = 10mA Iin = 10mA mA/C Vin = 5V
Notes: x When mounted on a 1" square PCB (FR-4 or G10 material). For recommended footprint and soldering techniques, refer to International Rectifier Application Note AN-994. y EAS is tested with a constant current source of 6A applied for 700S with V in = 0V and starting Tj = 25C. z Input current must be limited to less than 5mA with a 1k resistor in series with the input when the Body-Drain Diode is forward biased.
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IRSF3011
250 T = 25C 225 200 175 Vin = 5V 150 Vin = 8V 125 Vin = 10V 100 1 2 3 4 5 6 7 8 Rds(on) (mOhm) Rds(on) (mOhm) Vin = 4V
300 Ids = 4A 250 Vin = 5V 200
150 Vin = 10V 100
50 -50 -25 0 25 50 75 100 125 150 Ids (A)
Temperature (C)
Figure 3 On Resistance vs. Drain-to-Source Current
Figure 4 On Resistance vs. Temperature
Fig. 4 - On Resistance vs. Temperature
8 T = 25C Shut Down Current (A)
9 Vin = 5V Shut Down Current (A) 4 5 6 7 8 9 0 10 8
7.5
7
7
6
6.5
5
6
4 -50 -25 0 25 50 75 100 125 150 Input Voltage (Volts)
Temperature (C)
Figure 5 Over-Current Shutdown Threshold vs. Input Voltage
Figure 6 Over-Current Shutdown Threshold vs. Temperature
4
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IRSF3011
1.6 T=25C 1.4 Input Current (mA) Input Current (mA) 1.2 1 0.8 0.6 0.4 0.2 0 0 1 2 3 4 5 6 7 8 9 10 11 Iin,on Iin,off
0.6 Vin = 5V 0.5 0.4 0.3 0.2 Iin,on 0.1 0 -50 -25 0 25 50 75 100 125 150 Iin,off
Input Voltage (Volts)
Temperature (C)
Figure 7 Input Current vs. Input Voltage
Figure 8 Input Current vs.Temperature
0.9 0.8 Rise Time, On Delay (S) 0.7 0.6 0.5 Rise Time 0.4 0.3 0.2 0.1 0 3 4 5 6 7 8 9 10 11 On Delay T = 25C Rise Time, On Delay (S)
0.9 0.8 0.7 0.6 0.5 Vin = 5V 0.4 0.3 0.2 0.1 0 -50 -25 0 25 50 75 100 125 150 On Delay Rise Time
Input Voltage (Volts)
Temperature (C)
Figure 9 Turn-On Characteristics vs. Input Voltage
Figure 10 Turn-On Characteristics vs. Temperature
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IRSF3011
0.4 T = 25C 0.35 Fall Time, Off Delay (S) 0.3 0.25 0.2 0.15 Fall Time 0.1 0.05 0 3 4 5 6 7 8 9 10 11 Fall Time, Off Delay (S) Off Delay
0.4 Vin = 5V 0.35 Off Delay 0.3 0.25 0.2 0.15 Fall Time 0.1 0.05 0 -50 -25 0 25 50 75 100 125 150
Input Voltage (Volts)
Temperature (C)
Figure 11 Turn-Off Characteristics vs. Input Voltage
Figure 12 Turn-Off Characteristics vs. Temperature
10 Single Pulse Energy to Failure (mJ)
2000 Vdd=25V 1750 Ids = 4A 1500 1250 1000 750 500 250 0 0.5 0.6 0.7 0.8 0.9 1 1.1 1.2 0 25 50 75 100 125 150 Source to Drain Voltage (Volts)
Reverse Drain Current (A)
T = 150C
T = 25C
1
Starting Junction Temperature (C)
Figure 13 Source-Drain Diode Forward Voltage
Figure 14 Unclamped Single Pulse Inductive Energy to Failure vs. Starting Junction Temperature
6
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IRSF3011
Vin
Vin
5V
RL = 0
Vcc = 14V
50%
t Vds
90%
t I ds
I peak
10%
t
tdon tr tdoff tf
t Iblank
Short applied before turn-on
t Iresp
Short applied after turn-on
t
Figure 15 Definition of Switching Times
Figure 16 Definition of Ipeak, tlblank, tlresp
Vin
5V
V in
5V
t I ds
t < t reset I ds(sd) t > t reset
t I ds
t
RL = 1 mH Vcc = 14V
t Tresp RL = 10 Vcc = 14V T J = TJSD + 5C
t
Figure 17 Definition of t reset
Figure 18 Definition of tTresp
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IRSF3011
Case Outline SOT-223 (IRSF3011L)
NOTES: 1. Dimensioning and tolerancing per ANSI Y14.5M, 1982 2. Controlling dimension: INCH 3. Dimensions do not include lead flash 4. Conforms to JEDEC outline TO-261AA LEAD ASSIGNMENTS 1. Gate 2. Drain 3. Source 4. Drain
DIM A B B1 C D E e e1 H L L1
MILLIMETERS MIN MAX 1.55 1.80 0.65 0.85 2.95 3.15 0.25 0.35 6.30 6.70 3.30 3.70 2.30 BSC 4.60 BSC 6.71 7.29 -- 0.91 0.02 0.10 10 MAX
INCHES MIN MAX 0.061 0.071 0.026 0.033 0.116 0.124 0.010 0.014 0.248 0.264 0.130 0.146 .0905 BSC 0.181 BSC 0.287 0.264 -- 0.036 0.0006 0.004 10 MAX
8
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IRSF3011
Tape and Reel SOT-223 (IRSF3011L)
NOTES: 1. Controlling dimension: MILLIMETER 2. Conforms to outline EIA-481 and EIA-541 3. Each 330.00 (13.00) reel contains 2,500 devices.
NOTES: 1. Controlling dimension: MILLIMETER 2. Conforms to outline EIA-481-1 3. Dimension measured at hub 4. Includes flange distortion at outer edge
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IRSF3011
Case Outline TO-220AB (IRSF3011)
NOTES: 1. Dimensioning and tolerancing per ANSI Y14.5M, 1982 2. Controlling dimension: INCH 3. Dimensions shown are in millimeters (inches) 4. Conforms to JEDEC outline TO-251AA 5. Dimension does not include solder dip. Solder dip max. +0.16 (.006) LEAD ASSIGNMENTS 1. Gate 2. Drain 3. Source 4. Drain
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IRSF3011 Application Information
Introduction
Protected monolithic POWER MOSFETs offer simple, cost effective solutions in applications where extreme operating conditions can occur. The margin between the operating conditions and the absolute maximum values can be narrowed, resulting in better utilization of the device and lower cost. ESD protection also reduces the off-circuit failures during handling and assembly.
General Description
The IRSF3011 is a fully protected monolithic N-channel logic level POWER MOSFET with 200m (max) on-resistance. The built-in protections include over-current, over-temperature, ESD and over-voltage. The over-current and over-temperature protections make the IRSF3011 indestructible under any load conditions in switching or in linear applications. The built-in ESD protection minimizes the risk of ESD damage when the device is off-circuit. The IRSF3011 is fully characterized for avalanche operation and can be used for fast de-energization of inductive loads. The TO-220 packaged IRSF3011 offers an easy upgrade with direct pin-to-pin replacement from non-protected devices.
Block Diagram
As illustrated in figure A1, a zener diode between the input and the source provides the ESD protection for the input and also limits the voltage applied to the input to 10V. The R-S flip-flop memorizes the occurrence of an error condition and controls the Q2 and Q3 switches. The flipflop can be cleared by holding the input low for the specified minimum duration. COMP1 and COMP2 comparators are used to compare the over-current and over-temperature signals with the built-in reference. Either comparator can reset the fault flip-flop and turn Q1 off. During fault condition, Q2 disconnects the gate of Q1 from the input, and Q3 shorts the gate and source of Q1, resulting in rapid turn-off of Q1. The zener diode between the gate and drain of Q1 turns Q1 on when the drain to source voltage exceeds 55V.
Figure A1. Block Diagram Using higher input voltage will improve the turn-on time but it will not affect the turn-off switching speed. The typical waveforms at 7V input voltage are shown in Figure A3. In typical switching applications (below 60kHz) the difference in switching losses between the IRSF3011 and the same size standard MOSFET is negligible.
Input voltage 5V/div.
Drain voltage 5V/div.
Drain Current: 1A/div. Time: 1sV/div.
Switching Characteristics
In the IRSF3011, the control logic and the protection circuits are powered from the input pin. When positive voltage appears at the input pin, the R-S flip-flop turns Q2 on and connects the gate of the main device to the input. The turn-on speed is limited by the channel resistance of Q2 and the gate charge requirements of Q1. The typical switching waveforms at 5V input voltage are shown in Figure A2.
Figure A2. Waveforms switching clamped inductive load using 5V input voltage
Over-Current Protection
When the drain current exceeds the preset limit, the protection circuit resets the internal flip-flop and turns Q1 off. Normal operation can be restored by holding the input volt11
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IRSF3011
Input voltage 5V/div. Input voltage 5V/div.
Drain voltage 5V/div.
Drain voltage 5V/div.
Drain Current: 2A/div. Drain Current: 1A/div.
Time: 1sV/div.
Time: 10sV/div.
Figure A3. Switching waveforms with 7V Input voltage age below the specified threshold level (approx. 1.3V) for the specified minimum treset time. The typical waveforms at over-current shut-down are shown in Figure A4. After turn-on, the current in the inductor at the drain starts ramping up. At about 7A, the over-current protection shuts down the device.
Figure A4. Waveforms at over-current shut-down
Input voltage 10V/div.
Drain voltage 5V/div.
Over-Temperature Protection
Figure A5 illustrates the operation of the over-temperature protection. The IRSF3011 switches a 2 resistive load to a 10V power supply. When the thermal balance is established, the junction temperature is limited on a pulse-by-pulse basis.
Drain Current: 2A/div.
Over-Voltage Protection
When the drain-to-source voltage exceeds 55V, the zener diode between gate and drain turns the IRSF3011 on before the breakdown voltage of the drain-source diode is reached. This greatly enhances the energy the device can safely withstand during inductive load turn-offs compared
Time: 10sV/div.
Figure A5. Over-temperature shut-down to avalanche breakdown. Thus the device can be used for fast de-energization of inductive loads. The absorbed energy is limited only by the maximum junction temperature.
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12
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